Taiwan’s Powertech Technology will invest $400 million for a 30 percent equity stake in a joint venture with US semiconductor company Broadcom to build an advanced AI chip packaging facility in Singapore. Advanced Micro Devices (AMD) is the first client and can receive panel-level packaged chips in the second half of 2027. The venture operates through a newly formed entity called XCIP Technologies Pte. Ltd., with a total projected investment of $5.66 billion. It plans to develop fan-out panel-level packaging technology capable of producing approximately 45 of the largest AI chips in a single panel pass, compared with around eight or nine using conventional wafer-based processes. The investment will be drawn from the company’s own funds and injected in installments in line with construction progress and funding requirements. Broadcom has not disclosed the size of its own commitment. The venture will focus on fan-out panel-level packaging (FOPLP) and the development of additive finer-geometry redistribution layer technology, which routes electrical connections beyond the physical footprint of a silicon die. AMD is adopting the panel-based approach as an alternative to chip-on-wafer-on-substrate packaging. Powertech said its core technology and key intellectual property will remain in Taiwan. The deal is subject to approval from Taiwan’s Ministry of Economic Affairs Investment Review Department and other regulatory authorities.