Samsung Electronics and Broadcom have entered a strategic partnership worth more than $200 billion, targeting next-generation artificial intelligence infrastructure. The deal was signed on July 24, 2026, at the AI Summit in San Francisco, with participants including Han Jinman, president of Samsung’s Foundry Business, Broadcom CEO Hock Tan, Samsung Chairman Lee Jae-yong, and South Korean President Lee Jae-myung. Announced on July 25, the five-year collaboration through 2030 focuses on advanced memory semiconductor supply and AI chip foundry production. The partnership is valued at over $200 billion, or approximately 290 trillion Korean won. The agreement provides a “one-stop turnkey solution” covering memory supply, AI chip manufacturing, and advanced packaging. Samsung will supply next-generation memory solutions including HBM4 (6th generation) and HBM4E (7th generation) and deploy advanced foundry processes below 2 nanometers. Broadcom’s next-generation AI chips are expected to be produced at Samsung’s Pyeongtaek campus.