TSMC’s monthly 3nm chip wafer output is on track to hit 180,000 units in Q4 2026, two to three months earlier than originally planned. According to Taiwanese media reports via Yonhap, NVIDIA, AMD, and Broadcom are placing aggressive orders, prompting TSMC to convert some existing 5nm lines to 3nm production. The Snapdragon 8 Elite Gen 5 Galaxy, powering Samsung flagships, is built on TSMC’s N3P process, reducing bottleneck risks for Snapdragon availability as the Galaxy S26 series sells globally alongside the Galaxy Z Fold 8. AI demand is expanding from data centers into smartphones and humanoid robots, giving TSMC another growth wing. Working with Global Unichip Corp, TSMC reportedly completed tape-out for Tesla’s next-gen A15 AI chip on 3nm, a full quarter ahead of Samsung. Tesla’s AI6.5 chip is next, expected to move to TSMC’s 2nm process at its Arizona facility. TSMC’s new fabs in Southern Taiwan, Arizona, and Kumamoto are expected to push combined 2nm and 3nm output past 400,000 wafers a month by 2028.