Ceva, Inc. has unveiled its next-generation NeuPro NPU portfolio, featuring expanded capabilities and delivering up to 2X higher AI throughput per mm² and a 50% improvement in energy efficiency versus the first generation. Built on a common architecture and unified software stack, the portfolio is designed to support multimodal, generative and agentic AI workloads across Physical AI applications, from always-on sensing to advanced edge systems. The new architecture also marks Ceva's expansion into AI infrastructure, enabling intelligent memory, connectivity and data-processing silicon, as well as custom AI inference processors for cloud and data centers. According to Ceva, Physical AI systems increasingly rely on multiple AI models and intelligent agents working together, with perception and real-time responses close to the sensor and more complex reasoning and orchestration distributed across devices, edge systems and the cloud. The next-generation NeuPro portfolio offers a range of engines sized for different points in the system, with a unified software development kit spanning the portfolio so semiconductor designers can match an engine to each part of their system or combine several within one SoC while preserving their software investment. Yaron Galitzky, Executive VP, AI Division at Ceva, said working closely with the more than 15 customers who have licensed the first generation of NeuPro showed that successful AI products depend on the right balance of compute, memory, bandwidth, power and cost for each use case.