OpenAI and Broadcom unveiled Jalapeño, an LLM-optimized inference accelerator co-developed in a record nine-month tape-out, with Broadcom silicon implementation, Tomahawk networking, and advanced packaging behind it. OpenAI designed the chip from scratch around its understanding of LLM fundamentals while Broadcom and Celestica industrialize the platform. Engineering samples are already running ML workloads in the lab at production target frequency and power, including GPT-5.3-Codex-Spark. OpenAI says Jalapeño was co-developed from initial design to manufacturing tape-out in just nine months—what it believes is the fastest ASIC development cycle ever achieved in high-performance advanced semiconductors—accelerated in part by OpenAI’s own models. Early testing points to performance per watt “substantially better than current state-of-the-art,” with gigawatt-scale deployment alongside Microsoft and other partners starting at the end of 2026.