Longsys will showcase new products and edge AI storage solutions under the theme "Integrated Storage Empowering Edge AI" at electronica 2026, taking place November 10-13 in Munich, Germany. As AI moves from the cloud to edge devices, automotive and industrial applications require storage delivering high bandwidth, high endurance, and reliable operation across wide temperature ranges and harsh environments while supporting real-time perception and AI inference. At the show, Longsys will unveil its first industrial-grade, wide-temperature mSSD, built on system-in-package (SiP) technology that integrates the controller, flash memory, and passive components into a single package, eliminating the need for surface-mount technology (SMT) assembly and reducing material use and manufacturing process requirements. By eliminating solder joints associated with conventional PCB assembly, the design removes the associated risk of solder-joint failures, and with water resistance, dust protection, and shock resistance, the product delivers inherent industrial-grade reliability and wide-temperature operating capability. Longsys will also showcase a comprehensive portfolio of automotive-grade and industrial-grade storage, including UFS, eMMC, LPDDR, and SPI NAND Flash, while Lexar, Longsys's high-end consumer storage brand, will showcase dashcam USB drives and memory cards alongside industrial-grade SD and microSD solutions supporting applications spanning intelligent cockpits, ADAS, industrial control, and rail transit. Live demonstrations of AISSD, AIDIMM, and HLCache UFS will