Microsoft enlisted 3M to supply interconnect technologies, specifically 3M’s expanded beam optical (EBO) technology, to reduce the need for cleaning connectors across its cloud and AI infrastructure. Traditional connectors require frequent cleaning and inspection as dust can disrupt interconnections, but 3M’s EBO technology increases the beam area to overcome surface particles, allowing engineers to insert cables without worrying about contamination. The optical interconnect can be configured and scaled from 12 to 144 fibers, supporting both rack and infrastructure applications. Cliff Henson, Microsoft’s corporate VP for cloud supply chain and engineering, noted that the solution will help unlock new levels of performance, reliability, and efficiency. Microsoft’s early use of the tech showed potential to reduce network deployment timelines while demonstrating strong signal performance in live data center conditions.