SK Group, NVIDIA, Samsung, and Broadcom have announced AI supply chain partnerships with a total framework scale exceeding $700 billion, covering HBM4, AI factories, foundry production below 2nm, and advanced packaging. On July 24, SK Group and NVIDIA announced an expanded comprehensive partnership exceeding $500 billion at the AI Summit in San Francisco. Subsequently, Samsung Electronics signed an MOU with Broadcom, anticipating a collaboration scale exceeding $200 billion in memory and foundry over the next five years until 2030. A Bernstein report on July 27 focused on memory, noting that AI servers require HBM, DRAM, NAND, advanced packaging, and stable delivery beyond GPU expansion. The over $500 billion represents SK Group's comprehensive partnership with NVIDIA, including SK Telecom's up to 2GW AI factory and SK hynix's HBM4, with the first AI factory planned to go live in 2027. The Samsung-Broadcom MOU covers HBM, memory, support for next-generation AI accelerators, 2nm-related manufacturing, and 2.3D/2.5D integration. Actual procurement volumes, pricing, and delivery schedules have not yet been disclosed.