SK Hynix will hold the groundbreaking ceremony for its advanced semiconductor packaging manufacturing facility in West Lafayette, Indiana, on the 27th (local time). SK Hynix President Kwak Nojeong and other key executives are expected to attend, and industry insiders are watching for a possible meeting between SK Group Chairman Chey Taewon and Nvidia CEO Jensen Huang. According to the industry on August 12, SK Hynix has confirmed the date and sent official invitations to major clients and partners. If the two leaders meet, there is anticipation that an additional roadmap for semiconductor facility investment in the United States may be unveiled. Chairman Chey previously hinted at building memory manufacturing plants, stating, "If conditions such as power, water, workforce, and supply chain are met, memory production facilities can also be established." SK Hynix is investing $3.87 billion (about 5.5 trillion won) to construct the facility. Following completion of the main framework, the company aims to begin mass production of HBM and next-generation AI memory products in the second half of 2028. The U.S. government has decided to provide direct subsidies of up to $450 million (about 640 billion won) and loans of $500 million (about 710 billion won) under the CHIPS Act.