Samsung Electronics and Broadcom have signed a sweeping five-year semiconductor partnership, announced during the AI Summit in San Francisco on Friday, extending their collaboration through 2030 across high-bandwidth memory (HBM), advanced 2-nanometer foundry manufacturing, and cutting-edge chip packaging. Samsung said the memorandum of understanding is expected to generate more than $200 billion in business over the next five years. The deal reflects intensifying competition among AI chipmakers and cloud providers to secure critical semiconductor capacity years in advance. Under the agreement, Samsung will supply HBM for Broadcom's next-generation AI accelerators while expanding foundry cooperation to its 2-nanometer process, and the companies will jointly develop advanced packaging technologies including 2.3D and 2.5D integration. The partnership also covers Broadcom's Wireless Broadband Communications business. The trend of long-term agreements was highlighted earlier this month when Micron Technology told investors it had secured 16 long-term supply agreements worth roughly $22 billion.