Amkor Technology has signed a multi-year strategic partnership with NVIDIA to expand advanced semiconductor packaging and test technologies for next-generation AI infrastructure, backed by a $1.5 billion prepayment agreement. The deal will support the expansion of Amkor’s advanced packaging capacity in Arizona while strengthening the companies’ long-term collaboration on packaging technologies for AI and accelerated computing platforms. The agreement focuses on developing advanced packaging and test technologies for increasingly complex AI processors, aligning roadmaps around high-density interconnects and next-generation heterogeneous integration. Amkor already provides advanced packaging solutions for NVIDIA products including data center processors, networking devices, and accelerated computing platforms. As part of the agreement, NVIDIA will provide a prepayment that will fund the expansion of Amkor’s advanced packaging operations in the US, complementing Amkor’s existing manufacturing network across Asia. The partnership also underlines a commitment to expanding full turnkey advanced packaging and test services in the United States. Debora Shoquist, Executive Vice President of Operations at NVIDIA, stated that AI is driving a generational shift in technology and creating an opportunity to reinvigorate American manufacturing and supply chains.