SK Hynix will hold a groundbreaking ceremony for its advanced semiconductor packaging plant in West Lafayette, Indiana, on March 27, with a total investment of $3.87 billion. The potential joint attendance of SK Group Chairman Chey Tae-won and Nvidia CEO Jensen Huang has drawn industry focus. According to industry sources on March 12, SK Hynix has entered full-scale event preparations, sending invitations to major customers and partners. The ceremony is expected to draw key executives including SK Hynix CEO Kwak Noh-jung and CEOs from global Big Tech companies. Chairman Chey and CEO Huang have met multiple times across South Korea and the U.S. since last year, and their meeting could serve as a forum for discussing next-generation product roadmaps and collaboration, as SK Hynix is the core supplier of high-bandwidth memory (HBM) for Nvidia's AI accelerators. Chairman Chey's attendance is notable due to possible additional U.S. semiconductor investment plans; he recently hinted that "construction of a memory production plant is also possible if conditions such as power, water, workforce, and supply chain are met." U.S. Commerce Secretary Howard Lutnick recently publicly urged Samsung Electronics and SK Hynix to expand memory production in the United States. SK Hynix began on-site pouring work in the first half of this year and plans to commence full-scale structural construction following the ceremony, aiming to begin mass production of next-generation AI memory products, including H