Soitec, a French semiconductor company, has formed a strategic partnership with Chinese specialty foundry ZenSemi to ramp up high-volume production of advanced power chip technology, centering on 300mm BCD-on-SOI substrates. Soitec will supply its 300mm Power-SOI substrates to ZenSemi, which will use them to develop new manufacturing processes and expand production capacity. The target applications include AI datacenters, electric vehicles, humanoid robots, and industrial systems. Soitec holds over 4,800 active patents, most related to its engineered substrate technologies. The partnership bolsters ZenSemi’s process development and production capacities while showcasing the maturity of the BCD-on-SOI ecosystem within China’s semiconductor landscape. The positive market response reflects investor confidence in Soitec’s diversification strategy into power electronics.