According to a DigiTimes report, Huawei plans to begin mass production of a cutting-edge glass substrate by 2027 to elevate the progress of its AI chips, specifically the Ascend processors. The company will join hands with native suppliers to develop this new tech solution in China, as part of its efforts to reduce China’s reliance on US chip technology. Chinese chip component suppliers are making TGV (Through-Glass Via) and Glass Interposer, which serve as connectors between chipsets to improve speed and performance. Since Huawei cannot access EUV lithography machines, these glass substrates will enable production of cutting-edge Ascend processors without advanced tools. The materials resist higher temperatures and pressure, and Huawei adds that these components will make semiconductors 25% thinner and 30% more power efficient.