Intel announced a strategic collaboration with Lens Technology on July 27, 2026, to explore advanced semiconductor packaging technologies based on glass substrates, aiming to support the next generation of AI, data center, and high-performance computing systems. The partnership combines Intel’s expertise in advanced chip packaging with Lens Technology’s capabilities in precision glass processing and large-scale manufacturing to investigate new packaging approaches that could improve performance, increase interconnect density, and boost power efficiency. Glass substrates are emerging as a potential alternative to traditional organic substrates due to better dimensional stability, finer interconnect capability, and improved electrical performance. “Advanced packaging is becoming a critical driver of semiconductor innovation as AI systems continue to push the boundaries of performance, scale, and efficiency,” said Lip-Bu Tan, CEO of Intel. The companies also see opportunities to expand collaboration beyond packaging technology into components for AI PCs, thermal and structural solutions for data center servers, and hardware platforms for AI robotics, intelligent industrial equipment, and edge computing.