On September 8, 2026, Reuters reported that ASML Holding N.V. plans to work with major customers including Taiwan Semiconductor Manufacturing Company Limited, Nvidia, Intel, Samsung, and SK Hynix to adapt its next-generation "High NA" extreme ultraviolet lithography tools so they can print larger data-center chips, addressing a current limitation where the newer machines use a smaller mask than ASML's widely deployed standard EUV tools. ASML targets a pilot production line using the larger masks by 2031 and high-volume manufacturing readiness by 2033. Chief technology officer Marco Pieters said these changes could lift the productivity of these systems by roughly 40%. TSMC plans to introduce High NA EUV into advanced-node high-volume production from 2030. The larger-chip opportunity remains years away from contributing to either company's financial results, as investors cannot expect the new initiative to drive near-term revenue for either company.