Qualcomm used its investor day event in New York this week to unveil a new data-center portfolio, including the Dragonfly C1000 CPU and Dragonfly AI300 "inference accelerator," following the already-announced AI200 and AI200 accelerators, plus a proprietary High-Bandwidth Compute (HBC) architecture, new connectivity products, and custom silicon options. CEO Cristiano Amon said, “We’re going to become a full-stack player in physical AI, compute, everywhere.” EVP Tony Pialis said the connectivity portfolio will launch this year, followed by the new AI accelerator and custom silicon next year, and the new CPU in 2028. He outlined HBC’s performance advantages, including a 200x increase in capacity per watt compared with SRAM and a 6x increase in bandwidth per watt on large workloads compared with HBM. Qualcomm announced two top-tier data-center partners: Microsoft and Meta. Microsoft CEO Satya Nadella said in a video clip, “HBC implements an innovative architecture...that unlocks significant improvements in cost and performance for the next generation of AI infrastructure.” Meta CEO Mark Zuckerberg called the partnership “a multigenerational collaboration” that “will help put personal superintelligence into billions of people's hands.”